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INTEGRATED CIRCUITS
DATA SHEET
TEA1081 Supply circuit with power-down for telephone set peripherals
Product specification Supersedes data of February 1988 File under Integrated Circuits, IC03 September 1994
Philips Semiconductors
Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
FEATURES * High input impedance for audio signals * Low DC series resistance * High output current * Large audio signal handling capability * Low distortion * Two modes of operation: - output voltage that follows the DC line voltage - regulated output voltage * Power-down input * Low number of external components. QUICK REFERENCE DATA SYMBOL VLN VO VLN-O RS IO PARAMETER operating DC line voltage DC output voltage voltage drop from line to output internal series resistance output current (pin 7) TEA1081 TEA1081T VLN(rms) IINT Tamb AC line voltage (RMS value) internal supply current operating ambient temperature VLN = 4 V; IO = 15 mA; THD = 2% VLN = 4 V; IO = 0 mA; PD = LOW; VSP = VO VLN = 4 V - - - - -25 - - 1.5 0.8 - IO = 0 mA CONDITIONS MIN. 2.5 2.0 - - TYP. - - 0.5 20 GENERAL DESCRIPTION
TEA1081
The TEA1081 is an integrated circuit for use in line-powered telephone sets to supply peripheral circuits for extended dialling and/or loudspeaker facilities. The IC uses a part of the surplus line current normally drawn by the voltage regulator of the speech/transmission circuit. A power-down function isolates the IC from its load and reduces the input current.
MAX. 12.0 10.0 - - 30 20 - 1.4 +70
UNIT V V V mA mA V mA C
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TEA1081 TEA1081T DIP8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm VERSION SOT97-1 SOT96-1
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
BLOCK DIAGRAM
TEA1081
handbook, full pagewidth
1 LN
RS
TR1
7
QS
0.5 V A2 5 IF 3 AD A1
TR2
8 POWERDOWN 4
SP PD
REFERENCE CURRENT A3 2 VN 1/2 V O 6 VA
TEA1081
MLC166
Fig.1 Block diagram.
PINNING SYMBOL LN VN AD PD IF VA QS SP PIN 1 2 3 4 5 6 7 8 DESCRIPTION positive line terminal negative line terminal amplifier decoupling power-down input low-pass filter input output voltage adjustment power supply output supply input; power-down circuit
page
LN VN AD PD
1 2
8 7
SP QS VA IF
TEA1081
3 4
MLC167
6 5
Fig.2 Pin configuration.
September 1994
3
Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
FUNCTIONAL DESCRIPTION The TEA1081 is a supply interface between telephone line and peripheral devices in the telephone set. The high input impedance of the circuit allows direct connection to the telephone line (via a diode bridge). An inductor function is obtained by amplifier A1, resistor RS (see Fig.1) and an external low-pass RC filter. Under the control of amplifier A2, transistor TR1 supplies peripheral devices and transistor TR2 minimizes line signal distortion by momentarily diverting input current to ground whenever the instantaneous value of the line voltage drops below the output voltage. Internal circuits are biased by a temperature and line voltage compensated reference current source. The power-down circuit isolates the supply circuit from external circuitry. Line terminals: LN and VN (pins 1 and 2) The input terminals LN and VN can be connected directly to the line. The minimum DC line voltage required at the input is expressed by formula (1); see also Table 1. (1) V LN = I 1 x R S + V LNmin + V LN ( P ) ( V ) Table 1 Explanation of formula (1). SYMBOL I1 RS VLNmin VLN(P) input current internal series resistance minimum instantaneous line voltage (1.4 V at IO = 5 mA) required peak level of AC line voltage
2 (3) 4
TEA1081
The output voltage follows the line voltage and is expressed by formula (2); see also Table 2. V O = V LN - ( I 1 x R S + 0.5 ) ( V ) Table 2 Explanation of formula (2). SYMBOL VLN I1 RS line voltage input current internal series resistance DESCRIPTION
(2)
REGULATED OUTPUT VOLTAGE (SEE FIG.4) The circuit operates in this mode when an external resistor (RV) is connected between QS and VA (see Fig.6). The output voltage is held constant at VO = 2 x I6 x RV (V) as soon as the line voltage VLN > (2 x I6 x RV + I1 x RS + 0.5) (V) The control current I6 is typically 20 A.
handbook, halfpage
10
MLC168
VO (V) 8 (1) (2)
DESCRIPTION
6
The internal current (IINT) at IO = 0 mA is typically 0.8 mA at VLN = 4 V and reaches a maximum of 1.4 mA at VLN = 12 V. Supply terminals: QS and VA (pins 7 and 6) Peripheral devices are supplied from QS (pin 7). Two modes of output voltage regulation are available. OUTPUT VOLTAGE FOLLOWS LINE VOLTAGE (SEE FIG.3) The TEA1081 operates in this mode when there is no external resistor (RV) between QS and VA (see Fig.6).
0 0 2 4 6 8 10 VLN (V)
Application without RV. (1) I1 = 5 mA. (2) I1 = 20 mA. (3) I1 = 30 mA; not valid for TEA1081T.
Fig.3 Output voltage as a function of line voltage.
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
TEA1081
Input current at VLN(rms) = 1 V and without RV approximates to: I1 = IINT + 2 x IO (mA) The maximum supply current (within the specified output current limits) available for peripheral devices is shown by: I LINEmin - I LNmin - I INT IOmax = ---------------------------------------------------------2 Where:
MLC169
handbook, halfpage
6
VO (V) 4 (1) (2) (3) 2 75 k RV = 100 k
50 k
ILINEmin is the minimum line current of the telephone set; ILNmin is the specified minimum input current of the speech/transmission circuit.
0 0 2 4 6 8 VLN (V) 10
Input low-pass filter: IF (pin 5) The input impedance between LN and VN at audio frequencies is determined by the filter elements CL (between pins 1 and 5), RL (between pins 5 and 7) and the internal resistor RS (typical value 20 ). At audio frequencies the TEA1081 behaves as an inductor of the value LI = CL x RL x RS (H). The typical value of LI at CL = 2.2 F and RL = 100 k is 4.4 H. Amplifier decoupling: AD (pin 3)
RV connected between QS and VA. (1) I1 = 5 mA. (2) I1 = 20 mA. (3) I1 = 30 mA; not valid for TEA1081T.
Fig.4 Output voltage as a function of line voltage.
Input and output currents I1 and IO (pins 1 and 7) The maximum available current into pin 1 (I1) is determined by: * The minimum line current (ILINEmin) that is available for the telephone set * The specified minimum input current (ILNmin) for the speech/transmission circuit. That is I1max = ILINEmin - ILNmin. At VLN(rms) < 150 mV, the input current I1 is approximately: I1 = IINT + k x IO (mA) Where: IINT = internal supply current (0.8 mA at VLN = 4 V); k = correction factor (k < 1.1 for the specified output current range). With large line signals the instantaneous line voltage may drop below VO + 0.4 V. Normally (when VLN > VO + 0.4 V), instantaneous current flows from LN to QS (pin 1 to pin 7) to the output load. When VLN < VO + 0.4 V, the instantaneous current is diverted to pin 2 to prevent distortion of the line signal.
To ensure stability, a 68 pF decoupling capacitor is required between AD (pin 3) and LN (pin 1). If IOmin < 1.5 mA, a 47 pF capacitor has to be added between AD (pin 3) and VA (pin 6). Power-down inputs: PD and SP (pins 4 and 8) During pulse dialling or register recall, or if the input current to pin 1 is insufficient to maintain the output current, the supply to peripheral devices can be switched off by activating the PD input at pin 4. With PD = HIGH, the input current is reduced to 40 A (typ.) at VLN = 4 V and the internal circuits are isolated from the load at QS (pin 7). The power-down circuit is supplied via the SP input (pin 8). SP can be wired to QS in conditions where VO > VSPmin during line interruptions. When VO < VSPmin, SP should be wired to an external supply point (e.g. to VCC of the TEA1060 family circuit). When power-down is not required, the PD and SP inputs can be left open-circuit.
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VLN VLN(RM) VI I1 PARAMETER positive line voltage repetitive peak line voltage for a 1 ms pulse per 5 s input voltage (all other terminals) DC input current TEA1081 TEA1081T II Ptot Tamb Tstg Tj input current (all other terminals) total power dissipation operating ambient temperature storage temperature junction temperature -25 -40 - - - -1 120 80 +1 continuous during switch-on or line interruptions 12 resistor in series with pin 1 CONDITIONS - - - VVN - 0.5 MIN. 12
TEA1081
MAX. 12.5 28 VLN + 0.5
UNIT V V V V mA mA mA C C C
see Fig.5 +70 +125 +125
THERMAL CHARACTERISTICS SYMBOL Rth j-a TEA1081 TEA1081T (mounted on a printed-circuit board of 50 x 50 x 1.5 mm) PARAMETER thermal resistance from junction to ambient in free air 120 260 K/W K/W VALUE UNIT
MLC170
handbook, halfpage
800
Ptot (mW) (1) 600
400 (2)
200
0 0 20 40 60 80 100 120 o Tamb ( C)
(1) TEA1081. (2) TEA1081T.
Fig.5 Power derating curves.
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
TEA1081
CHARACTERISTICS VLN = 4 V; VLN(rms) = 100 mV; IO = 5 mA; f = 300 to 3400 Hz; RL = 100 k; CL = 2.2 F; RV = 75 k; Tamb = 25 C; unless otherwise specified; see Fig.6. SYMBOL VLN VLNmin VLNmax PARAMETER operating DC line voltage minimum instantaneous line voltage maximum instantaneous line voltage CONDITIONS MIN. 2.5 - 12.0 - - - TYP. - - - MAX. 12.0 1.4 - - - - UNIT V V V
Characteristics with RV = 75 k connected between pins 6 and 7 and CL = 10 F I1 VO VO input current (pin 1) output voltage (pin 7) variation of output voltage over the ranges of: line voltage temperature temperature output current I6 control current (pin 6) Characteristics without RV I1 VLN-O IO input current (pin 1) voltage drop from line to output output current (pin 7) TEA1081 TEA1081T RS IINT internal series resistance internal supply current IO = 0 mA; PD = HIGH (note 1); VSP > 2 V THD BRL VLN(2H) VLN(3H) Vni(rms) total harmonic distortion balance return loss second harmonic level of line voltage third harmonic level of line voltage noise voltage on input terminal (RMS value) VLN(rms) = 1.5 V 600 reference f = 500 Hz; VLN = 0 dBm; Zline = 600 f = 500 Hz; VLN = 0 dBm; Zline = 600 VLN(rms) = 0 V; RL = 600 ; P53 curve - - - IO = 0 mA; PD = LOW; VSP = VO - - - 25 - - - - - 20 0.8 40 - - -58 -60 -83 30 20 - 1.4 60 2 - - - - mA mA mA A % dB dBm dBm dBmp VLN(rms) = 0 V VLN(rms) = 1.5 V; IO = 15 mA IO = 0 mA IO = 15 mA; VLN(rms) = 1.5 V - - - - 6.0 31 0.5 1.1 - - - - mA mA V V VLN = 4 to 6 V Tamb = +25 to -25 C Tamb = +25 to +75 C IO = 5 to 20 mA - - - - - 100 -100 -100 -100 20 - - - - - mV mV mV mV A VLN(rms) = 0 V VLN(rms) = 1.5 V; IO = 15 mA 5.8 30 3.0 mA mA V
Power-down input (pin 4) VIL VIH I4 LOW level input voltage HIGH level input voltage input current 7 - 1.5 - - - - 0.3 VSP 10 V V A
September 1994
Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
SYMBOL PARAMETER CONDITIONS MIN. TYP. - -
TEA1081
MAX.
UNIT
Power-down input (pin 8) V8 I8 Note 1. Power-down circuit supplied via external source. APPLICATION INFORMATION supply voltage for power-down supply current to power-down circuit V8 = 3 V 2 - VLN 70 V A
I1
handbook, full pagewidth
CL = 2.2 F
CD = 68 pF AD SPEECH/ TRANSMISSION CIRCUIT V LN PD SP 3 4 8 1
LN 5
IF 6 VA
CS = 47 pF RV
RL = 100 k
TEA1081 2 VN 7 QS IO
TELEPHONE LINE
CO
VO
PERIPHERAL CIRCUITS
MLC171
Fig.6 Application diagram.
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
PACKAGE OUTLINES
TEA1081
handbook, full pagewidth
9.8 9.2
8.25 7.80
seating plane
3.2 max 4.2 max
3.60 3.05
0.51 min
1.15 max
2.54 (3x) 1.73 max
0.53 max
0.254 M
0.38 max 7.62 10.0 8.3
MSA252 - 1
8
5
6.48 6.20
1
4
Dimensions in mm.
Fig.7 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
TEA1081
handbook, full pagewidth
5.0 4.8
4.0 3.8
A
S
0.1 S
6.2 5.8
0.7 0.3
8
5 1.45 1.25
0.7 0.6
0.25 0.19
1.75 1.35
1 pin 1 index
4
0.25 0.10 detail A
1.0 0.5
0 to 8
o
MBC180 - 1
1.27
0.49 0.36
0.25 M (8x)
Dimensions in mm.
Fig.8 Plastic small outline package; 8 leads; body width 3.9 mm (SO8; SOT96-1).
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low-voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small-outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW
TEA1081
Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA1081
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
NOTES
TEA1081
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
NOTES
TEA1081
September 1994
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Philips Semiconductors
Product specification
Supply circuit with power-down for telephone set peripherals
NOTES
TEA1081
September 1994
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Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., 6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)428 6729 India: Philips INDIA Ltd, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)14163160/4163333, Fax. (01)14163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors LTD., 276 Bath road, Hayes, MIDDLESEX UB3 5BX, Tel. (081)73050000, Fax. (081)7548421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD34 (c) Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
413061/1500/02/pp16 Document order number: Date of release: September 1994 9397 739 40011
Philips Semiconductors

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